Effect of Bi addition on mechanical properties of Sn-9Zn-1Sb soldering alloys

Sn-Zn based alloys are considered as a good candidate for the replacement of traditional Pb-containing solder alloy and the alloys containing one or more additional metal are being used as alternating soldering alloy with better properties. In this work, eutectic Sn-9Zn and five Tin-Zinc-Antimony-Bismuth ternary and quaternary alloys will be prepared, and their mechanical, thermal and electrical properties will be investigated. The solder alloy used for the study are, Sn-9Zn; Sn-9Zn-1Sb; Sn-9Zn-1Sb-0.5Bi; Sn-9Zn-1Sb-1Bi; Sn-9Zn-1Sb -2Bi; Sn-9Zn-1Bi-3Sb and are denoted as B0, B1, B2, B3, B4 and B5 respectively. The property like microhardness, tensile strength, the electrical conductivity and thermal properties, XRD and microstructure will be investigated

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